Core Features 

1. Compact size ‌ : Utilizing an integrated molding process, its volume is reduced by over 30% compared to traditional inductors, and its thickness can be as low as 0.5mm or less, making it suitable for ultra-thin device design. ‌

2. High-frequency performance ‌ : It operates stably in high-frequency environments of 5MHz and above, 

3. Low loss ‌ : Lower DC resistance (DCR), excellent temperature rise current performance, and 20% lower power consumption than traditional inductors during long-term full-load operation. ‌  

4. Magnetic shielding structure ‌ : The fully enclosed magnetic circuit design effectively isolates electromagnetic interference and is suitable for high-density circuit board environments. ‌

Main Applications

1. Consumer electronics ‌ : power management modules for smart phones and tablet computers and 5G communication circuits. ‌  

2. Automotive electronics ‌ : anti-vibration circuit design for on-board instruments and dash.

3. Emerging fields ‌ : power supply and filtering systems for AR/VR devices, wearable devices and new energy vehicles.